Cable assemblies installed in environments with high moisture, high humidity, or potential water immersion must operate reliably for years without premature failure. Designers must evaluate the assembly's ability to prevent water ingress while also considering long-term exposure risks such as fungal or mold growth.
Epec has experience designing and manufacturing cable assemblies for some of the most stringent environmental conditions. Our engineering teams understand both application-driven requirements and the codes applicable to moisture-exposed cable assemblies and wire harnesses.
Protection against water ingress is commonly defined using the IP Code (International Protection Marking, IEC standard 60529). This system classifies and rates the level of protection provided by electrical enclosures and connectors against contact, dust, and water.
The IP Code is intended to replace vague terms such as “waterproof” with measurable performance criteria. Each digit represents compliance with specific test conditions. If no data exists for a criterion, an “X” is used. If no protection is provided, a “0” is assigned.
The most common IP ratings applied to cable assemblies are IP67 and IP68. In both cases, the assemblies are defined as dust tight. For moisture-focused applications, the fourth digit, which specifies water ingress protection, is the primary concern.
| Parameter | Value | Units |
|---|---|---|
| IP67 immersion depth | 1 | meter |
| IP67 immersion duration | 30 | minutes |
| IP68 immersion depth | up to 3 | meters |
| IP68 immersion duration | greater than 30 | minutes |
| Fungal test temperature | 29 ± 1 | °C |
| Fungal test humidity | ≥ 95 | % RH |
| Fungal test duration | 28 | days |
For IP67, components are immersed in water to a depth of 1 meter for 30 minutes, with no harmful water ingress permitted. IP68 test conditions exceed IP67 requirements but are defined by the component manufacturer; in most cases, this includes greater immersion depths and longer durations.
In certain applications, such as lifesaving devices used aboard shipping vessels, fungal growth resistance is required in addition to water ingress protection. These environments demand component materials that inhibit mold and fungal growth both on external surfaces and within the assembly.
The fungal growth test involves spraying the cable assembly with a mold spore suspension and placing it in a controlled high-humidity chamber. The chamber maintains elevated temperature and humidity for an extended incubation period. After testing, assemblies are inspected, and acceptable performance is defined as little or no fungal growth.
| Fungal test temperature | 29 ± 1 | °C |
|---|---|---|
| Fungal test humidity | ≥ 95 | % RH |
| Fungal test duration | 28 | days |
Cable assemblies designed for high-moisture or water exposure are commonly used in:
These applications place ongoing environmental stress on cable assemblies, requiring robust sealing and material choices.
Epec engineers begin with a clear understanding of the environment in which the cable assembly will be installed. This drives component selection and design decisions aligned with both application demands and environmental exposure risks.
A vertically integrated manufacturing approach allows engineering and production teams to collaborate closely throughout the build process. By keeping production steps in-house, Epec ensures a consistent understanding of application requirements and delivers cable assemblies that meet both internal quality standards and customer expectations.
Environments with high moisture, high humidity, or potential immersion in water present an increased risk for water ingress and long-term reliability issues.
Water ingress can lead to premature failure, electrical issues, and loss of long-term reliability if not addressed during design and manufacturing.
The IP Code defines measurable protection levels against dust and water, replacing vague descriptors with standardized test criteria.
Both are dust-tight, but IP68 exceeds IP67 water immersion requirements, with test conditions defined by the manufacturer and typically involving greater depths and longer durations.
Fungal growth testing is required in applications such as lifesaving equipment where mold resistance is critical to performance and safety.
Epec selects components based on environmental requirements, designs assemblies to meet applicable codes, and maintains in-house production control to ensure consistency and reliability.
Epec designs custom IP67 and IP68 cable assemblies built to repel water and resist fungal growth. Work with our engineering team to ensure long-term reliability in demanding moisture-exposed environments.
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